This paper presents a hybrid process chain for efficiently machining hard silicon nitride. The process includes a laser treatment phase to weaken the material, followed by diamond grinding. Optimized laser parameters have been identified to control the generation of a network of cracks that weakens the volume of material to be ground. Comparison of data between traditional and hybrid process chain shows a reduction in grinding force of about thirty per cent in the latter case. A finite element model has been developed for the analysis of thermal stresses generated by laser exposure and the prediction of crack formation.

A laser assisted hybrid process chain for high removal rate machining of sintered silicon nitride

BRUZZONE, ALESSANDRO
2015-01-01

Abstract

This paper presents a hybrid process chain for efficiently machining hard silicon nitride. The process includes a laser treatment phase to weaken the material, followed by diamond grinding. Optimized laser parameters have been identified to control the generation of a network of cracks that weakens the volume of material to be ground. Comparison of data between traditional and hybrid process chain shows a reduction in grinding force of about thirty per cent in the latter case. A finite element model has been developed for the analysis of thermal stresses generated by laser exposure and the prediction of crack formation.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11567/862300
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