Interfacial reactions in the SbeSn/Cu and SbeSn/Ni systems have been investigated by means of wetting experiments. The wetting behaviour of two lead-free alloys, namely, Sb2.5Sn97.5 and Sb14.5Sn85.5 (at.%), in contact with Cu and Ni-substrates has been studied in view of possible applications as high-temperature solders in the electronics industry. The contact angle measurements on Cu and Ni plates were performed by using a sessile drop apparatus. The solder/substrate interface was characterised by the SEM-EDS analyses.
Interfacial reactions in the Sb-Sn/(Cu, Ni) systems: Wetting experiments
DELSANTE, SIMONA;BORZONE, GABRIELLA
2012-01-01
Abstract
Interfacial reactions in the SbeSn/Cu and SbeSn/Ni systems have been investigated by means of wetting experiments. The wetting behaviour of two lead-free alloys, namely, Sb2.5Sn97.5 and Sb14.5Sn85.5 (at.%), in contact with Cu and Ni-substrates has been studied in view of possible applications as high-temperature solders in the electronics industry. The contact angle measurements on Cu and Ni plates were performed by using a sessile drop apparatus. The solder/substrate interface was characterised by the SEM-EDS analyses.
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