The thermodynamic properties play a crucial role in the development of new solder materials. In this work a calorimetric investigation of the ternary Cu-Sn-Bi system was carried out by using a Calvet-type calorimeter in order to obtain the molar limiting partial enthalpy of Cu in liquid Sn-Bi alloys with different compositions. The molar limiting partial enthalpy of Cu at 820 K was determined in the Sn-75 at% Bi, Sn-43 at% Bi and Sn-26 at% Bi liquid bath showing an endothermic behaviour. The results are compared with the literature data available for Cu in the pure liquid Bi and Sn and then discussed.

Calorimetric investigation of the Cu-Sn-Bi lead-free solder system

DELSANTE, SIMONA;PARODI, NADIA;BORZONE, GABRIELLA
2008-01-01

Abstract

The thermodynamic properties play a crucial role in the development of new solder materials. In this work a calorimetric investigation of the ternary Cu-Sn-Bi system was carried out by using a Calvet-type calorimeter in order to obtain the molar limiting partial enthalpy of Cu in liquid Sn-Bi alloys with different compositions. The molar limiting partial enthalpy of Cu at 820 K was determined in the Sn-75 at% Bi, Sn-43 at% Bi and Sn-26 at% Bi liquid bath showing an endothermic behaviour. The results are compared with the literature data available for Cu in the pure liquid Bi and Sn and then discussed.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11567/251288
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