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EnglishThe Cu-Sn-Sb system has been experimentally investigated by a combination of optical microscopy, differential scanning calorimetry (DSC) and electron probe microanalysis (EPMA). DSC was used to identify a total number of five invariant ternary reactions and the Sn:Sb = 1:1 isopleth section up to 65 at.% Cu was constructed by combining the DSC data with the EPMA analyses of annealed alloys and literature information. The composition limits of the binary phases were detected.
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| Titolo: | Lead-free soldering: investigation of Cu-Sn-Sb system along the Sn:Sb = 1:1 isopleth |
| Autori: | |
| Data di pubblicazione: | 2011 |
| Rivista: | |
| Abstract: | The Cu-Sn-Sb system has been experimentally investigated by a combination of optical microscopy, differential scanning calorimetry (DSC) and electron probe microanalysis (EPMA). DSC was used to identify a total number of five invariant ternary reactions and the Sn:Sb = 1:1 isopleth section up to 65 at.% Cu was constructed by combining the DSC data with the EPMA analyses of annealed alloys and literature information. The composition limits of the binary phases were detected. |
| Handle: | http://hdl.handle.net/11567/265374 |
| Appare nelle tipologie: | 01.01 - Articolo su rivista |
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