Food packaging encompasses the topical role of preserving food, hence, extending the shelf-life, while ensuring the highest quality and safety along the production chain as well as during storage. Intelligent food packaging further develops the functions of traditional packages by introducing the capability of continuously monitoring food quality during the whole chain to assess and reduce the insurgence of food-borne disease and food waste. To this purpose, several sensing systems based on different food quality indicators have been proposed in recent years, but commercial applications remain a challenge. This review provides a critical summary of responsive systems employed in the real-time monitoring of food quality and preservation state. First, food quality indicators are briefly presented, and subsequently, their exploitation to fabricate intelligent packaging based on responsive materials is discussed. Finally, current challenges and future trends are reviewed to highlight the importance of concentrating efforts on developing new functional solutions.

Intelligent packaging for real-time monitoring of food-quality: Current and future developments

Dodero A.;Escher A.;Bertucci S.;Castellano M.;Lova P.
2021-01-01

Abstract

Food packaging encompasses the topical role of preserving food, hence, extending the shelf-life, while ensuring the highest quality and safety along the production chain as well as during storage. Intelligent food packaging further develops the functions of traditional packages by introducing the capability of continuously monitoring food quality during the whole chain to assess and reduce the insurgence of food-borne disease and food waste. To this purpose, several sensing systems based on different food quality indicators have been proposed in recent years, but commercial applications remain a challenge. This review provides a critical summary of responsive systems employed in the real-time monitoring of food quality and preservation state. First, food quality indicators are briefly presented, and subsequently, their exploitation to fabricate intelligent packaging based on responsive materials is discussed. Finally, current challenges and future trends are reviewed to highlight the importance of concentrating efforts on developing new functional solutions.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11567/1047303
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