Technologies based on chemical etching have been used since the fifties by industry to manufacture products for niche markets. In this paper an analysis has been carried out by using a particular experimental set-up which avoid the effect of the convective flow during copper etching. The correlation between the etching process parameters on material removal and surface microgeometry are investigated

Influence of chemical etching parameters on material removal and microgeometry

BRUZZONE, ALESSANDRO;LONARDO, PIETRO
2008-01-01

Abstract

Technologies based on chemical etching have been used since the fifties by industry to manufacture products for niche markets. In this paper an analysis has been carried out by using a particular experimental set-up which avoid the effect of the convective flow during copper etching. The correlation between the etching process parameters on material removal and surface microgeometry are investigated
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11567/318345
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